Developing Terahertz Meta Sensing Capability

Dr. Abhijit Biswas

March 2024 VT&C Digital Magazine

Energy Harvesting: Biomechanical, Biochemical and Hybrid Devices

Dr. Peter Martin

February 2024 VT&C Digital Magazine

Remote Plasma Sources for Effluent Treatment and Foreline Cleaning

Steve Hansen

January 2024 VT&C Digital Magazine

Differences Between Standard and Infrared Spectroscopic Ellipsometry

Dr. Matthew Linford and Team

December 2023 VT&C Digital Magazine

Nanotech-Enabled Soft Intelligent Robots for Futuristic Technologies

Dr. Abhijit Biswas

November 2023 VT&C Digital Magazine

Mass Spectrometry Enabled Discovery of Neurobiomakers to Combat Incurable, Heterogeneous and Age-Dependent Neurodegenerative Diseases

Dr. Megha Agrawal and Dr. Shyamasri Biswas

October 2023 VT&C Digital Magazine
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Industry News

Pfeiffer Vacuum: Pfeiffer Vacuum introduces new HiCube® Neo turbo pumping station

With pumping speeds ranging from 80 to 800 l/s, the HiCube Neo vacuum pumping station is ideal for demanding high vacuum and ultra-high vacuum applications. The HiCube Neo can be prepared for wide-ranging applications with an array of different backing pumps such as diaphragm, rotary vane, scroll and multi-stage Roots pumps. This makes the new turbo pumping station perfect for applications in industry and research & development. Typical uses range from analyzing gases and calibrating vacuum gauges to pumping down cryostats and use in vacuum furnaces. The versatile HiCube Neo adapts to requirements – from a compact desktop solution to a standalone unit.

DHF Tech: The Workhorse of Sputtering Systems Deserves a Great Horseshoe

Sputtering Systems from MRC and the Upsilon Target Continue to Do the Heavy Lifting for Leading Companies and Institutions. People say the Gold Upsilon Sputtering Target from DHF Technical Products looks like a lot of things: A picture frame. A box. A rectangle. But if you look closely, you can also see part of a horseshoe. Which makes sense because the Upsilon Target has been essential in helping the workhorse of sputtering systems from MRC run beautifully for decades. Sputtering Systems Born to Run and Run and Run.

RD Mathis: 3 Common Types of Evaporation Sources

Evaporation sources are components used in the process of physical vapor deposition (PVD), a technique used to deposit thin films of material onto a substrate. Here’s an overview of three commonly used sources: 1. Alumina Coated Evaporation Sources 2. Tungsten Evaporation Baskets 3. Point Source Filaments

Instrutech: PCM301 Busy Bee™ Pirani Capacitance

The new PCM301 Busy Bee combines the ceramic capacitance diaphragm technology with a pirani sensor in a single device to provide pressure measurements from 2.80E-05 to 1,125 Torr. Due to the use of the capacitance diaphragm sensor the gauge is gas independent for pressures above 7.6 Torr, allowing safe venting with any gas mixture. PCM301 is available with various fittings including 1/8 in. NPT male, NW16KF, NW25KF, 1 1/3 in. Mini-Conflat, 4VCR and 8VCR.

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VT&C Featured Buyer's Guide 2022

PISTON PUMPS


VT&C Buyer's Guide 2022

Vacuum Technology Primer

Since 2000 Vacuum Technology & Coating Magazine has been the industry's leading source for the latest articles, news, and product and service information. Below we describe some of the terms that you will find in a typical issue of VT&C.

Vacuum Coating (Vacuum Deposition and Thin Film Deposition) is the process of depositing a film or other material atom by atom or molecule by molecule onto a surface in a low pressure environment or vacuum.

Physical Vapor Deposition or PVD refers to vacuum deposition methods which involve the material (which is being deposited) going from a condensed phase to a vapor phase and then to a thin film condensed phase. Sputtering and evaporation are common PVD processes.

Sputtering refers to a type of process used to deposit thin films and employs a plasma to bombard and eject atoms from a target source.

Evaporation refers to the heated source material being evaporated in a vacuum. Vacuum allows vapor particles to travel directly to the target object, where they condense back to a solid state. (called a Deposition Source) refers to a type of process used to deposit thin films and employs a plasma to bombard and eject atoms from the target source (called a Deposition Source).

Vacuum Hardware refers to the types of hardware and components that are used in the vacuum process. There are many types of hardware used in this process, some examples are flanges, fittings, seals, valves, and chambers.

Thin Film Metrology involves determining the optimal thickness, composition and/or condition of a coating through various techniques and mathematical calculations.

Gas Analytical Systems are used in the analysis of residual gases within a low pressure environment or vacuum.

Vacuum Pumps are devices that remove gas atoms and molecules for the purpose of leaving behind a partial vacuum. Some examples of types of vacuum pumps are rotary vane pumps, diaphragm pumps, and scroll pumps.

Every issue of VT&C includes a product showcase focused on a specific topic relevant to Vacuum Processing, please see our editorial calendar which lists the topic for each issue.