The Dark Energy Spectroscopic Instrument (DESI) has capped off the first seven months of its survey run by smashing through all previous records for three-dimensional galaxy surveys, creating the largest and most detailed map of the universe ever. Yet it’s only about 10% of the way through its five-year mission. Once completed, that phenomenally detailed 3D map will yield a better understanding of dark energy, and thereby give physicists and astronomers a better understanding of the past – and future – of the universe. Meanwhile, the impressive technical performance and literally cosmic achievements of the survey thus far are helping scientists reveal the secrets of the most powerful sources of light in the universe.
Metrology manufacturer, k-Space Associates, Inc., is proud to introduce their newest thin-film metrology product, kSA ACE (Atomic Control for Epitaxy). k-Space engineers designed this tool with input from scientists in the research and production communities to provide an accurate and high-resolution in situ instrument that monitors flux and growth rate of atomic species, using the principle of atomic absorption spectroscopy. The kSA ACE uses conventional hollow cathode lamps (HCLs) to generate the atomic emission for the elements of interest. The instrument utilizes two high-sensitivity, UV-optimized solid-state spectrometers — one to monitor the absorption and the other to monitor signal drift from the HCLs.
If you had a jar of marbles of many different colors but wanted only the green ones, how could you efficiently pick them out? What if it wasn’t marbles but a jar of glitter, and there was sand, glue, and mud mixed in? That begins to describe the complexity of the brine pumped out from beneath California’s Salton Sea as part of geothermal energy production.
Researchers at the Department of Energy’s Oak Ridge, Brookhaven and Idaho national laboratories and Stony Brook University have developed a novel approach to gain fundamental insights into molten salts, a heat transfer medium important to advanced energy technologies.
Since 2000 Vacuum Technology & Coating Magazine has been the industry's leading source for the latest articles, news, and product and service information. Below we describe some of the terms that you will find in a typical issue of VT&C.
Vacuum Coating (Vacuum Deposition and Thin Film Deposition) is the process of depositing a film or other material atom by atom or molecule by molecule onto a surface in a low pressure environment or vacuum.
Physical Vapor Deposition or PVD refers to vacuum deposition methods which involve the material (which is being deposited) going from a condensed phase to a vapor phase and then to a thin film condensed phase. Sputtering and evaporation are common PVD processes.
Sputtering refers to a type of process used to deposit thin films and employs a plasma to bombard and eject atoms from a target source.
Evaporation refers to the heated source material being evaporated in a vacuum. Vacuum allows vapor particles to travel directly to the target object, where they condense back to a solid state. (called a Deposition Source) refers to a type of process used to deposit thin films and employs a plasma to bombard and eject atoms from the target source (called a Deposition Source).
Vacuum Hardware refers to the types of hardware and components that are used in the vacuum process. There are many types of hardware used in this process, some examples are flanges, fittings, seals, valves, and chambers.
Thin Film Metrology involves determining the optimal thickness, composition and/or condition of a coating through various techniques and mathematical calculations.
Gas Analytical Systems are used in the analysis of residual gases within a low pressure environment or vacuum.
Vacuum Pumps are devices that remove gas atoms and molecules for the purpose of leaving behind a partial vacuum. Some examples of types of vacuum pumps are rotary vane pumps, diaphragm pumps, and scroll pumps.
Every issue of VT&C includes a product showcase focused on a specific topic relevant to Vacuum Processing, please see our editorial calendar which lists the topic for each issue.