Redwood City, CA. – For immediate release – XEI Scientific Inc. Receives US Patent 10,486,236 for a Plasma Device with an External RF Hollow Cathode for Plasma Cleaning of High Vacuum Systems used in Evactron® E-50 model and U50 model plasma cleaners. The Evactron E50 model was introduced in 2017 and is now XEI‘s most popular in-situ downstream plasma cleaner for SEMs, with its easy plasma ignition directly from high vacuum using the “POP” ignition process developed by XEI Scientific. The design places the electrode outside the plasma to eliminate particulate production. This efficient hollow cathode plasma radical source is able to operate with 50 Watts of RF power to generate plasma rather than heat and plasma as in ICP-type plasma cleaners.
Onto Innovation Inc. (NYSE: ONTO) today announced the successful completion on October 25, 2019 of the previously announced merger of equals between Nanometrics Incorporated and Rudolph Technologies, Inc. Headquartered in Wilmington, Massachusetts, Onto Innovation is expected to be the fourth largest semiconductor capital equipment supplier by revenue in the U.S. and a top 15 semiconductor equipment company by revenue worldwide, based on Gartner’s most recent semiconductor wafer fab equipment market share report, released in April 2019.
MKS Instruments, Inc. (NASDAQ: MKSI), a global provider of technologies that enable advanced processes and improve productivity, today announced the release of its next generation C-Series Mass Flow Controllers. The C-Series Mass Flow Controller uses Micro-Electromechanical Systems (MEMS) technology combined with a fast-acting control valve and MKS’ proprietary algorithms resulting in an ultra-fast control time of less than 100 milliseconds. Designed for use with non-corrosive gases and accommodating a wide flow range from 50sscm to 50slm, the C-Series is ideal for many advanced markets that require high-precision flow control including, but not limited to, Analytical, Biopharmaceutical and Industrial applications. “By leveraging MEMS technology, we provide the optimum solution for critical process applications requiring precise gas flow control under the most demanding conditions across multiple industries,” said Michael Patterson, General Manager of Flow Solutions Products.
The New York and Tel Aviv based startup Dynamic Infrastructure is implementing the world’s first deep-learning solution which allows bridge and tunnel owners and operators to obtain visual diagnosis of the assets they manage. The system provides live, cloud-based, 3D views of the bridge or tunnel and automatically alerts when changes are detected in maintenance and operation conditions - before the issues evolve into large-scale failures.
Since 2000 Vacuum Technology & Coating Magazine has been the industry's leading source for the latest articles, news, and product and service information. Below we describe some of the terms that you will find in a typical issue of VT&C.
Vacuum Coating (Vacuum Deposition and Thin Film Deposition) is the process of depositing a film or other material atom by atom or molecule by molecule onto a surface in a low pressure environment or vacuum.
Physical Vapor Deposition or PVD refers to vacuum deposition methods which involve the material (which is being deposited) going from a condensed phase to a vapor phase and then to a thin film condensed phase. Sputtering and evaporation are common PVD processes.
Sputtering refers to a type of process used to deposit thin films and employs a plasma to bombard and eject atoms from a target source.
Evaporation refers to the heated source material being evaporated in a vacuum. Vacuum allows vapor particles to travel directly to the target object, where they condense back to a solid state. (called a Deposition Source) refers to a type of process used to deposit thin films and employs a plasma to bombard and eject atoms from the target source (called a Deposition Source).
Vacuum Hardware refers to the types of hardware and components that are used in the vacuum process. There are many types of hardware used in this process, some examples are flanges, fittings, seals, valves, and chambers.
Thin Film Metrology involves determining the optimal thickness, composition and/or condition of a coating through various techniques and mathematical calculations.
Gas Analytical Systems are used in the analysis of residual gases within a low pressure environment or vacuum.
Vacuum Pumps are devices that remove gas atoms and molecules for the purpose of leaving behind a partial vacuum. Some examples of types of vacuum pumps are rotary vane pumps, diaphragm pumps, and scroll pumps.
Every issue of VT&C includes a product showcase focused on a specific topic relevant to Vacuum Processing, please see our editorial calendar which lists the topic for each issue.