Non-Destructive Parallel Angle-resolved XPS/HAXPES Depth Profiling with a Three-color X-ray Source
Dr. Matthew Linford Team
Princeton Scientific RF Matching Network with Auto/Manual tune and control, are designed and manufactured to be compatible with the RF generator with an output impedance of 50 ohms according to standards. The plasma enclosure, plasma torch or other loads that require the application of RF power and have an equivalent impedance other than 50 ohms and are usually accompanied by an inductor and capacitor segment. Therefore, a system is required to change the equivalent impedance to the generator impedance level in order to prevent the reflection of the power transmitted by the generator, protect the RF generator, maximize the power input to the load, make the processes repeatable, and provide the necessary field intensity in the enclosure before and after the formation of plasma.
Webinar Series by Jeremy Van Derslice
REDWOOD CITY, CA – XEI Scientific, Inc., the global leader in downstream plasma cleaning technology for electron microscopy, is pleased to announce a change in ownership. The company has been acquired by Christopher Booth and Michal Rabara, who will take the helm to guide the company through its next phase of growth and technological advancement.
Lightweight, non-magnetic and contamination free, aluminum and vacuum chambers are ideal for semiconductor, quantum computing, and cryogenics. Bonded dissimilar metals are ideal as transitions between two metals that cannot be traditionally welded, such as aluminum and stainless steel.
Since 2000 Vacuum Technology & Coating Magazine has been the industry's leading source for the latest articles, news, and product and service information. Below we describe some of the terms that you will find in a typical issue of VT&C.
Vacuum Coating (Vacuum Deposition and Thin Film Deposition) is the process of depositing a film or other material atom by atom or molecule by molecule onto a surface in a low pressure environment or vacuum.
Physical Vapor Deposition or PVD refers to vacuum deposition methods which involve the material (which is being deposited) going from a condensed phase to a vapor phase and then to a thin film condensed phase. Sputtering and evaporation are common PVD processes.
Sputtering refers to a type of process used to deposit thin films and employs a plasma to bombard and eject atoms from a target source.
Evaporation refers to the heated source material being evaporated in a vacuum. Vacuum allows vapor particles to travel directly to the target object, where they condense back to a solid state. (called a Deposition Source) refers to a type of process used to deposit thin films and employs a plasma to bombard and eject atoms from the target source (called a Deposition Source).
Vacuum Hardware refers to the types of hardware and components that are used in the vacuum process. There are many types of hardware used in this process, some examples are flanges, fittings, seals, valves, and chambers.
Thin Film Metrology involves determining the optimal thickness, composition and/or condition of a coating through various techniques and mathematical calculations.
Gas Analytical Systems are used in the analysis of residual gases within a low pressure environment or vacuum.
Vacuum Pumps are devices that remove gas atoms and molecules for the purpose of leaving behind a partial vacuum. Some examples of types of vacuum pumps are rotary vane pumps, diaphragm pumps, and scroll pumps.
Every issue of VT&C includes a product showcase focused on a specific topic relevant to Vacuum Processing, please see our 2026 editorial calendar which lists the topic for each issue.
