The Game Changing Concept of Future Mobile Communication Network
Dr. Abhijit Biswas
American Elements CEO Michael Silver interview on CNBC. (click for more)
Asslar, November 12, 2024 – Pfeiffer Vacuum+Fab Solutions unveils the Series E, the first electric angle valve for high vacuum applications. These new valves set an industry standard with superior control, energy efficiency, reliability, and significant cost savings. (click for more)
INTELLIVATION LLC is thrilled to announce the addition of Dr. Robert Malay to our team as the new Application Lab Director. The Application Lab includes two R2R Vacuum Coating systems and our Laser system for patterning and annealing thin film coatings. (click for more)
Join us in celebrating the sale of the 5000th Evactron plasma cleaner, marking 25 years of continuing progress in fighting hydrocarbon contamination. Dr. Barbara Armbruster, XEI Vice President of Sales and Marketing says “In 1999 our founder Ronald Vane invented the Evactron, the first commercial in-situ plasma cleaner designed for use on an electron microscope. XEI Scientific has the technological leadership position in a global market, a dedicated workforce, and strong financial performance as proven by our sales achievement. (click for more)
Since 2000 Vacuum Technology & Coating Magazine has been the industry's leading source for the latest articles, news, and product and service information. Below we describe some of the terms that you will find in a typical issue of VT&C.
Vacuum Coating (Vacuum Deposition and Thin Film Deposition) is the process of depositing a film or other material atom by atom or molecule by molecule onto a surface in a low pressure environment or vacuum.
Physical Vapor Deposition or PVD refers to vacuum deposition methods which involve the material (which is being deposited) going from a condensed phase to a vapor phase and then to a thin film condensed phase. Sputtering and evaporation are common PVD processes.
Sputtering refers to a type of process used to deposit thin films and employs a plasma to bombard and eject atoms from a target source.
Evaporation refers to the heated source material being evaporated in a vacuum. Vacuum allows vapor particles to travel directly to the target object, where they condense back to a solid state. (called a Deposition Source) refers to a type of process used to deposit thin films and employs a plasma to bombard and eject atoms from the target source (called a Deposition Source).
Vacuum Hardware refers to the types of hardware and components that are used in the vacuum process. There are many types of hardware used in this process, some examples are flanges, fittings, seals, valves, and chambers.
Thin Film Metrology involves determining the optimal thickness, composition and/or condition of a coating through various techniques and mathematical calculations.
Gas Analytical Systems are used in the analysis of residual gases within a low pressure environment or vacuum.
Vacuum Pumps are devices that remove gas atoms and molecules for the purpose of leaving behind a partial vacuum. Some examples of types of vacuum pumps are rotary vane pumps, diaphragm pumps, and scroll pumps.
Every issue of VT&C includes a product showcase focused on a specific topic relevant to Vacuum Processing, please see our editorial calendar which lists the topic for each issue.
