Recent Breakthroughs in Hybrid Optical Modulators Integrating Silicon Photonics with Electro-Optic Materials
Dr. Abhijit Biswas
New engineered materials demand new approaches as insights into ultra-thin films, surfaces, and interfaces are often obscured by the limitations of even traditional surface analysis techniques. StrataPHI 3.0 introduces an updated characterization platform designed for non-destructive, depth-resolved analysis of multi-layer films composed of ultra-thin layers. (Click for more)
Scientists in California say they may have found a cleaner way to make one of modern life's most important materials: graphite. Their process turns waste carbon dioxide into solid carbon rather than relying on material extracted from the ground, a shift that could one day help supply batteries, electronics, and power equipment.
This milestone marks six decades since the commercialization of the company's first helium leak detector, the ASM 4, and highlights the continuous development of a portfolio that has supported demanding industrial and scientific applications around the world. (Click for more)
A line of vacuum foreline traps that are ideally suited for manufacturing processes such as ALD (atomic layer deposition) that generate large volumes of solid byproducts, organic solvents, and other contaminants have been introduced by Mass-Vac, Inc. of North Billerica, Massachusetts.
Since 2000 Vacuum Technology & Coating Magazine has been the industry's leading source for the latest articles, news, and product and service information. Below we describe some of the terms that you will find in a typical issue of VT&C.
Vacuum Coating (Vacuum Deposition and Thin Film Deposition) is the process of depositing a film or other material atom by atom or molecule by molecule onto a surface in a low pressure environment or vacuum.
Physical Vapor Deposition or PVD refers to vacuum deposition methods which involve the material (which is being deposited) going from a condensed phase to a vapor phase and then to a thin film condensed phase. Sputtering and evaporation are common PVD processes.
Sputtering refers to a type of process used to deposit thin films and employs a plasma to bombard and eject atoms from a target source.
Evaporation refers to the heated source material being evaporated in a vacuum. Vacuum allows vapor particles to travel directly to the target object, where they condense back to a solid state. (called a Deposition Source) refers to a type of process used to deposit thin films and employs a plasma to bombard and eject atoms from the target source (called a Deposition Source).
Vacuum Hardware refers to the types of hardware and components that are used in the vacuum process. There are many types of hardware used in this process, some examples are flanges, fittings, seals, valves, and chambers.
Thin Film Metrology involves determining the optimal thickness, composition and/or condition of a coating through various techniques and mathematical calculations.
Gas Analytical Systems are used in the analysis of residual gases within a low pressure environment or vacuum.
Vacuum Pumps are devices that remove gas atoms and molecules for the purpose of leaving behind a partial vacuum. Some examples of types of vacuum pumps are rotary vane pumps, diaphragm pumps, and scroll pumps.
Every issue of VT&C includes a product showcase focused on a specific topic relevant to Vacuum Processing, please see our 2026 editorial calendar which lists the topic for each issue.
