Join us in celebrating the sale of the 5000th Evactron plasma cleaner, marking 25 years of continuing progress in fighting hydrocarbon contamination. Dr. Barbara Armbruster, XEI Vice President of Sales and Marketing says “In 1999 our founder Ronald Vane invented the Evactron, the first commercial in-situ plasma cleaner designed for use on an electron microscope. XEI Scientific has the technological leadership position in a global market, a dedicated workforce, and strong financial performance as proven by our sales achievement. (read for more)
Industry leaders are taking advantage of the extensive benefits of aluminum in UHV to improve the performance of their most challenging applications in the fields of cryogenics, aerospace, physics, and semiconductors. For processes that require high thermal conductivity, light-weight materials, or chemical resistance aluminum delivers advanced functionality, and at a fraction of the cost. (read for more)
By modifying the genomes of plants and microorganisms, synthetic biologists can design biological systems that meet a specification, such as producing valuable chemical compounds, making bacteria sensitive to light, or programming bacterial cells to invade cancer cells. (read for more)
Researchers at the Department of Energy’s Oak Ridge National Laboratory joined forces with EPB of Chattanooga and the University of Tennessee at Chattanooga to demonstrate the first transmission of an entangled quantum signal using multiple wavelength channels and automatic polarization stabilization over a commercial network with no downtime (click for more)
Since 2000 Vacuum Technology & Coating Magazine has been the industry's leading source for the latest articles, news, and product and service information. Below we describe some of the terms that you will find in a typical issue of VT&C.
Vacuum Coating (Vacuum Deposition and Thin Film Deposition) is the process of depositing a film or other material atom by atom or molecule by molecule onto a surface in a low pressure environment or vacuum.
Physical Vapor Deposition or PVD refers to vacuum deposition methods which involve the material (which is being deposited) going from a condensed phase to a vapor phase and then to a thin film condensed phase. Sputtering and evaporation are common PVD processes.
Sputtering refers to a type of process used to deposit thin films and employs a plasma to bombard and eject atoms from a target source.
Evaporation refers to the heated source material being evaporated in a vacuum. Vacuum allows vapor particles to travel directly to the target object, where they condense back to a solid state. (called a Deposition Source) refers to a type of process used to deposit thin films and employs a plasma to bombard and eject atoms from the target source (called a Deposition Source).
Vacuum Hardware refers to the types of hardware and components that are used in the vacuum process. There are many types of hardware used in this process, some examples are flanges, fittings, seals, valves, and chambers.
Thin Film Metrology involves determining the optimal thickness, composition and/or condition of a coating through various techniques and mathematical calculations.
Gas Analytical Systems are used in the analysis of residual gases within a low pressure environment or vacuum.
Vacuum Pumps are devices that remove gas atoms and molecules for the purpose of leaving behind a partial vacuum. Some examples of types of vacuum pumps are rotary vane pumps, diaphragm pumps, and scroll pumps.
Every issue of VT&C includes a product showcase focused on a specific topic relevant to Vacuum Processing, please see our editorial calendar which lists the topic for each issue.