Towards Realizing Fully Integrated Electronic-Photonics Circuits on the Silicon Platform
Dr. Abhijit Biswas
MKS is proud to announce the release of our new Process Technologies in Advanced Packaging Handbook. This handbook provides a comprehensive guide exploring heterogeneous integration and cutting-edge interconnect technologies, the key to sustaining Moore’s Law in the post-scaling era. (click for more)
According to new research from Counterpoint Research’s AI 360 practice – ‘What’s Next for AI: How Will It Shape the Semiconductor Market’, semiconductor revenues are estimated to double from 2024 to 2030 to reach over $1 trillion, driven by the global AI transformation to build infrastructure and consumption end points for GenAI to Agentic AI to Physical AI applications. (click for more)
Join us in celebrating the sale of the 5000th Evactron plasma cleaner, marking 25 years of continuing progress in fighting hydrocarbon contamination. Dr. Barbara Armbruster, XEI Vice President of Sales and Marketing says “In 1999 our founder Ronald Vane invented the Evactron, the first commercial in-situ plasma cleaner designed for use on an electron microscope. XEI Scientific has the technological leadership position in a global market, a dedicated workforce, and strong financial performance as proven by our sales achievement. (click for more)
Gentex presented DHF Technical Products with a 2024 Supplier of the Year award at their annual Supplier Conference on May 22nd. DHF Tech was one of 19 suppliers chosen by Gentex for delivering outstanding performance in quality, cost competitiveness, delivery support, innovation and dedication to Gentex. Gentex also awarded winners in diversity and sustainability categories. (click for more)
Since 2000 Vacuum Technology & Coating Magazine has been the industry's leading source for the latest articles, news, and product and service information. Below we describe some of the terms that you will find in a typical issue of VT&C.
Vacuum Coating (Vacuum Deposition and Thin Film Deposition) is the process of depositing a film or other material atom by atom or molecule by molecule onto a surface in a low pressure environment or vacuum.
Physical Vapor Deposition or PVD refers to vacuum deposition methods which involve the material (which is being deposited) going from a condensed phase to a vapor phase and then to a thin film condensed phase. Sputtering and evaporation are common PVD processes.
Sputtering refers to a type of process used to deposit thin films and employs a plasma to bombard and eject atoms from a target source.
Evaporation refers to the heated source material being evaporated in a vacuum. Vacuum allows vapor particles to travel directly to the target object, where they condense back to a solid state. (called a Deposition Source) refers to a type of process used to deposit thin films and employs a plasma to bombard and eject atoms from the target source (called a Deposition Source).
Vacuum Hardware refers to the types of hardware and components that are used in the vacuum process. There are many types of hardware used in this process, some examples are flanges, fittings, seals, valves, and chambers.
Thin Film Metrology involves determining the optimal thickness, composition and/or condition of a coating through various techniques and mathematical calculations.
Gas Analytical Systems are used in the analysis of residual gases within a low pressure environment or vacuum.
Vacuum Pumps are devices that remove gas atoms and molecules for the purpose of leaving behind a partial vacuum. Some examples of types of vacuum pumps are rotary vane pumps, diaphragm pumps, and scroll pumps.
Every issue of VT&C includes a product showcase focused on a specific topic relevant to Vacuum Processing, please see our editorial calendar which lists the topic for each issue.
